AMTECH NC-559-ASM Solder Paste

• ROL0 flux classification
• Wide process window
• Excellent wetting compatibility on most board finishes
• Clear residue
• High temperature compatible

Application:

NC-559-ASM-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. It may be used for BGA sphere attachment and reballing. Additionally, NC-559-ASM-TF is designed to work on all flip chip bumping and chip scale packaging sites.